-
-
High end screen printing machine Galaxy
The equipment can be used for mass production of 0.25 mm and less than 0.25 mm diameter (e.g. 0.17 mm) planting balls
-
-
KNs Mounter / ASM mounter
Flip chip placement requirements, compact high-performance modules to support mass production, equipment precision of 25 μ m
-
-
reflow oven
Reflow soldering furnace is used to solder SMT components to PCB in SMT process
-
-
Circuit board flip chip cleaner
From pre cleaning to solution cleaning, clean water washing to drying, complete cleaning process ensures chip filling and testing
-
-
SPI
SPI is a high-speed full duplex synchronous communication bus, and only occupies four wires on the chip pins
-
-
AOI 3D inspection
AOI equipment is to use the camera and other hardware equipment to obtain the image of the detected object
